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Brian Harper

Associate Professor


PhD 1983, Texas A&M University

Room E341
201 W. 19th Ave.
Columbus, OH 43210

614-292-3531

Email: harper.10

Thrust Area(s): Applied Mechanics

Research

Dr. Harper's main research interests are in the area of time-dependent behavior of polymeric materials. This research involves the experimental characterization of the effects of temperature and moisture upon time-dependent (viscoelastic) phenomena such as creep and stress relaxation as well as the development of constitutive models incorporating these effects. Also of interest are synergistic effects of temperature and moisture (i.e. hygrothermal history dependence) upon the mechanical behavior of polymers. Currently, the primary application of these efforts is related to the mechanical performance and reliability of microelectronic packages. Dr. Harper's research has been supported by IBM and by the Semiconductor Research Corporation.

Selected Publications

  1. B.D. Harper, "Influence of Polymer Visco-elasticity on a Bending Bilayer," Journal of Electronic Packaging, Vol. 116, pp. 191-197, September 1994.
  2. B.D. Harper, J.M. Rao, V.H. Kenner, and C.H. Popelar, "Hygrothermal Effects upon Stress Relaxation in a Polyimide Film," ASME Journal of Electronic Materials, to appear, June 1997.
  3. B.D. Harper, V. Itkin, and V.H. Kenner, "Effects of Temperature and Moisture upon Stress Relaxation in an Epoxy Molding Compound," 6th International Workshop on Moisture in Microelectronics, National Institute of Standards and Technology, Gaithersburg, MD, October 15-17, 1996.

   ME @ OSU

Graduate Program Information Session
October 17, 10 a.m. to 1:00 p.m.